CEA-Leti has achieved a major milestone for next-generation chip stacking: fully functional 2.5 V SOI CMOS devices fabricated at 400 °C. The devices match electrical performance of devices fabricated ...
Advantest has introduced the M5241 Memory Handler, its next-generation handler developed to meet the performance, automation ...
Leti, discusses CEA-Leti’s launch of a multilateral program on microLED technology for ultra-fast data transfer, with a ...
MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics ...
The extreme purity requirements associated with chip technology on an atomic level – where even a single particle can have an ...
David MacQueen, Service Director, Executive Programs at TechInsights, discusses the five key trends, as identified in the ...
Imec says that the European Research Council (ERC) has awarded a Consolidator Grant to Anton Potočnik, for his project ...
Their paper details 3D sequential integration of silicon-germanium (SiGe) heterojunction bipolar transistors (HBT), RF SOI switches, and high-quality passives on a single wafer—opening a path to ...
Imec presents the first comprehensive thermal study of 3D HBM-on-GPU integration using a system-technology co-optimization ...
According to Research intelo, the Global Silicon Carbide Inverter for Heavy Vehicles market size was valued at $1.2 billion in 2024 and is projected to reach $5.8 billion by 2033, expanding at an ...
Yeungnam University, a leading academic institution in South Korea, will utilize Veeco’s GEN10 MBE technology to expand its ...
Dragonfly 3D World 2025, a major software upgrade that redefines how scientists and engineers explore, analyze, and quantify ...
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