A new technical paper titled “High-yield photolithography protocol to pattern metallic electrodes on 2D materials without ...

Layer Design of Vector-Symbolic Computing: Bridging Cognition and Brain-Inspired Hardware Acceleration” was published by ...

Water usage at scale requires sophisticated closed-loop systems, digital twins, and multiple filtration strategies, but can ...

Fig. 1: Modeling qubits in a realistic way involves large-scale atomistic models with possibly amorphous materials, disorder, ...

Narrowly defined verticals offer the best opportunities for AI. Plus, what will the impact be on junior engineers?

Why have wafer shipments remained flat while AI semiconductor demand is booming and fab investments are rising?

A new technical paper titled “Architecting Long-Context LLM Acceleration with Packing-Prefetch Scheduler and Ultra-Large ...

A new technical paper titled “Ultra Ethernet’s Design Principles and Architectural Innovations” was published by researchers ...

A new technical paper titled “Physical Design Exploration of a Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes ...

Today, there are still many ways for defects to slip through final testing and get shipped to customers. However, in-line ...

Time-of-flight sensors; manufacturing quantum chips; collaboration for growth; wafer shipment conundrum; sparse linear ...

Machine learning is a mathematical construct that is the foundation for nearly all the advancements in AI. ML came first, but ...