Samsung Electronics' sixth-generation high-bandwidth memory (HBM4), delivered to Nvidia in July 2025, has reportedly cleared reliability testing, positioning it for pre-production by late August. The milestone is viewed as a concrete result of Samsung chairman Lee Jae-yong's recent meeting with Nvidia CEO Jensen Huang.

NVIDIA CEO Jensen Huang has dismissed security concerns over the company’s H20 chips, saying they pose no national risk to China and that continued sales would benefit both sides. His remarks follow reports that NVIDIA has slowed development of the H20 after Beijing urged domestic firms to avoid the chip.

Samsung reportedly offered NVIDIA its 12-layer HBM3E memory at 20-30% cheaper than SK hynix for use on its made-for-China H20 AI GPU.

Driven by the booming demand for artificial intelligence (AI) servers, high-bandwidth memory (HBM) has become a key factor reshaping the memory industry landscape. Micron recently announced that its entire HBM supply for 2026 is already fully booked,

Samsung may have stumbled in the AI race, losing its DRAM crown to SK Hynix, but with HBM4, mega foundry deals, and bold R&D bets, the comeback clock is ticking. The question is—will they reboot in time,

Samsung Electronics confirms its supply of new HBM3E 12-Hi memory to NVIDIA, with 30K to 50K units of Samsung HBM3E to NVIDIA in the 'near future'

Nvidia has reportedly suspended production of its China-focused H20 AI chip as Beijing pushes domestic alternatives and analysts warn the uncertainty could hit its Q3 outlook.

Nvidia Corp. ordenó a sus proveedores de componentes, entre los que se incluyen Samsung Electronics Co. y Amkor Technology Inc., que detengan la producción relacionada con el chip H20 AI, según informó The Information citando fuentes no identificadas.

Samsung's new HBM4 memory samples sent to NVIDIA have reportedly passed their tests, with mass production now imminent to fight SK hynix and Micron.