Abstract: Chipping has emerged as a significant issue in semiconductor manufacturing, particularly during the dicing process. The existing conventional single-sided wafer mounting technique does not ...
Abstract: We developed an innovative chip-on-wafer-on-wafer (CoWoW) process, involving a three-layer vertically stacked structure comprising face-to-back (F2B) chip-on-wafer (CoW) and face-to-face ...
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