A research team co-led by Professor Yang Lu from the Department of Mechanical Engineering, Faculty of Engineering, The University of Hong Kong (HKU), and Professor Chengming Li from the Institute for ...

US laboratory backs 3D printing for reactor parts, aiming to speed approvals, cut costs, and boost safety in next-gen nuclear ...

Working at scales both simultaneously vast and incomprehensively nanoscopic, a team of thousands of designers, contractors, and craft workers delivered Intel’s 2.9-million-sq-ft chip fabrication ...

This article provides a detailed guide to the top engineering colleges in India in 2026, including leading government ...

Beyond defence, GaN also has strong civilian potential. “GaN can handle more current and switch at higher frequency, which reduces the size and weight of power systems,” Gupta said, noting that ...

Enzene’s New Jersey facility offers efficient, fully continuous or hybrid vat production within a modular framework.

India has made steady progress in consolidating earlier investments into a full-stack value chain of its semiconductor ecosystem under ISM 1.0 ...

Intel Corp. today showcased a new class of Intel Core Ultra X9 and X7 processors, the first new chips built on its most advanced 18A manufacturing process. Announced at the CES electronics trade show ...

In a previous article we reviewed rapid forming of thermoplastic composites (TPC). In the second part of this three-part series, we’ll explore the thermal processes and how these can be managed, ...

At some point in our lives, we have dropped a drinking glass or knocked over a glass-blown knickknack, only to watch it hit the floor and shatter into pieces. We learn from any early age that glass is ...