The result is that the entire board is much denser, and comments can be installed on both sides of the PC board, as seen in Figure 2 . Since the board does not require drilling for component leads ...
AEC-Q200 Qualified Devices Offered in Five Compact Case Sizes for Automotive, Industrial, and Telecommunications Applications ...
As electronic products move from prototyping to mass production, manufacturers must rely on efficient, scalable, and ...
Desperate times call for desperate measures. Raspberry Pi has decided to introduce a dual RAM variant of the Raspberry Pi 4 ...
A new technical paper titled “Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging” was published by researchers at Sungkyunkwan University and ...
Article subjects are automatically applied from the ACS Subject Taxonomy and describe the scientific concepts and themes of the article. Glass substrates have gained considerable attention as ...
Altus Group, a leading distributor of electronics production equipment in the UK and Ireland, is highlighting Heller Industries’ innovative Short-Cycle Vacuum Reflow Oven (SCVR) as interest in high ...
Littelfuse Inc. extends its K5V Series of illuminated tactile switches with the release of new K5V4 models including the gull-wing and 2.1-mm pin-in-paste (PIP) versions compatible with reflow ...
Littelfuse announced the expansion of its K5V Series illuminated Tactile Switch family with the release of new K5V4 models. These include Gull Wing (GH) and 2.1 mm Pin-in-Paste (PIP) versions that are ...
In the wake of the AI and Electric Vehicle (EV) era, efficient power supply and conversion have become a critical battleground. For over a decade, 3S Silicon Tech has been deeply committed to ...
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