Abstract: This paper presents a numerical study on the SiO 2 /Cu Chip-to-Wafer Hybrid Bonding (C2W-HB) process. The annealing process is modelled using the Finite Element Analysis tool. The effects of ...

Tools like Synera are likely to be increasingly used by manufacturers as there are significant speed advantages over lengthy manual workflows. Synera’s concept of selecting the AI model is quite ...

FElupe is a Python 3.10+ finite element analysis package focusing on the formulation and numerical solution of nonlinear problems in continuum mechanics of solid bodies. This package is intended for ...

Founder of the world wide web says commercialisation means the net has been ‘optimised for nastiness’, but collaboration and compassion can prevail Get our breaking news email, free app or daily news ...

The breakthrough is often credited to Scottish inventor John Logie Baird—but the real history is far more complicated and collaborative. John Logie Baird with his transmitting station on March 19, ...

This repository has been deprecated and all its content was moved to the new one located here https://github.com/autodesk-platform-services/aps-configurator-inventor ...