Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...
This white paper tackles the importance of epoxy-based underfill encapsulants in flip chip technology and semiconductor industry. This is a guide on selecting compounds and enhancing the reliability ...
The demand for lighter, faster, smaller and less expensive products has led the electronics manufacturing industry to the use of new packaging techniques such as Flip Chip technology. In most cases, ...
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