Abstract: Transient liquid phase (TLP) die-attach bonding is an attractive technique for high-temperature semiconductor device packaging. In this paper, the material reliability of gold–indium (Au–In) ...
Abstract: Wideband measurement of the apparent charge of partial discharges (PDs) that may occur in liquid-filled power transformers and shunt reactors excited by ac test voltages between 40 Hz and ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results