Abstract: Monolithic inter-layer vias (MIVs) used in 3D integration technology are much smaller than through-silicon vias (TSVs) used in TSV-based 3D integration. Thus, monolithic 3D integration ...
Abstract: By utilizing a suspension cable to connect the payload with the quadrotor, transport tasks can be accomplished while preserving the unmanned aerial vehicle’s agility and maneuverability, ...
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Does cable size matter?

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