IM doubles down on long-term eMMC reliability as others exit the market With our new low-density eMMC portfolio, ...

PLEASANTON, CA, UNITED STATES, February 10, 2026 /EINPresswire.com/ -- Inneos today announced Cheetah, a ruggedized ...

As many memory manufacturers discontinue their eMMC product lines, Intelligent Memory has launched a new, low-density eMMC product line. The new eMMCs will come in 8GB and 16 GB densities in a ...

Intelligent Memory has introduced a new generation of embedded MultiMediaCards (eMMC) aimed at industrial applications.

The global electronics industry continues to rely heavily on China’s advanced PCB manufacturing capabilities. As electronic devices become increasingly sophisticated, the demand for high-quality ...

In today’s advanced packages, however, resistance no longer resides primarily inside transistors or neatly bounded test ...

Advanced Rework Technology (A.R.T.) has upgraded its UK facility by installing the latest BGA rework system from PDR Rework for use in its training courses. This supports consistency and repeatability ...

After the release of the high-performance EPYC Embedded 9005, AMD has now introduced the EPYC Embedded 2005 Series, a mid-range processor family also based on the “Zen 5” architecture and designed for ...

19x19mm body, 22X22 array 484 ball BGA package to be SMT attached to top adapter or placed inside compression mount socket mounted to top adapter. Bottom adapter ... Socket and test 4x4mm QFN with ...

It’s not always straightforward, but understanding the basics really helps. Key Takeaways Chip BGA packaging uses solder balls underneath the chip to connect to a circuit board, allowing for more ...