Qualcomm announces Snapdragon X75, the first 5G Advanced-ready modem-RF system Your email has been sent Forward-looking AI and 5G characterize Qualcomm’s Snapdragon X75 for 3GPP's Release 17 and 18.

Qualcomm unveiled its latest Snapdragon modem at Mobile World Congress 2024 in, Barcelona, Spain, the Qualcomm Snapdragon X80 5G Modem-RF System, and it is designed to be used across multiple ...

New line of Telit Cinterion 5G data cards and LGA modules will leverage Snapdragon X72 5G Modem-RF System These new products target high-performance routers, gateways and CPEs for consumers and ...

The cutting-edge 5G AI FWA solution activates the generated AI voice/text interaction and visual presentation on 5G CPE devices by deploying AI agent and an AI-related algorithm on Snapdragon X75 5G ...

IRVINE, Calif., Feb. 22, 2024 /PRNewswire/ -- Telit Cinterion, an end-to-end IoT solutions enabler, announces the Telit Cinterion FE990B34/40 LGA family of modules, powered by the Snapdragon® X72 5G ...

Among several Qualcomm new products and partnerships announced at the Mobile Worldwide Congress (MWC) in Barcelona, Qualcomm Technologies, Inc. unveiled its much smarter 5th generation ...

During MWC Barcelona 2023, Fibocom to unveil the 5G Sub-6GHz and mmWave module Fx190/Fx180 series based on Snapdragon® X75 and X72 5G Modem-RF System, by integrating AI innovations in architecture ...

State-of-the-art Telit Cinterion FE990B34/40 LGA module family driven by the latest and greatest 3GPP Release 17 5G chipset High-power quad-core CPU delivers substantial processing power for customer ...